Intel CEO Lip-Bu Tan, a key figure in the global PC chip industry, is expected to visit Odisha later this year for the ground-breaking ceremony of a semiconductor plant by 3D Glass Solutions. The event will coincide with the launch of SicSem’s silicon carbide unit, scheduled for next month, with commercial production set to begin in two years.

According to Vishal Kumar Dev, Principal Secretary of the Odisha Electronics and IT Department, both SicSem and 3DGS have committed to starting their units promptly. While SicSem’s foundation-laying is confirmed for next month, 3D Glass Solutions is awaiting a final date from Lip-Bu Tan.

The 3D Glass semiconductor packaging unit will be developed by Heterogeneous Integration Packaging Solutions Pvt Ltd with support from Intel, Lockheed Martin, and Applied Materials. With an investment of Rs 1,943 crore, the project aims to achieve an annual production capacity of 5 crore units.

Meanwhile, SicSem Private is partnering with UK-based Clas-SiC Wafer Fab to establish India’s first Compound Semiconductor fabrication plant at InfoValley, Bhubaneswar. Additionally, RIR Power Electronics has informed the Chief Minister that its Rs 618 crore SiC wafer fab is already operational and will begin commercial production in March 2026.

To attract investment and talent, the Odisha government has rolled out a revised semiconductor policy, offering 50% of central incentives and extra benefits for students. Engineering students opting for semiconductor studies will receive Rs 10,000 in support, along with opportunities to develop their own chips for commercial use.

In its official statement, the state confirmed two fresh agreements for electronics manufacturing projects with a total investment of Rs 2,655 crore.